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geda:pcb_footprint_naming_conventions [2010/01/08 13:45] ptay created (moved footprint creation OUT of gEDA Symbol Creation pg. |
geda:pcb_footprint_naming_conventions [2014/04/18 12:24] vzh Add link to Russian translation |
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+ | //Translations of this page are also available in the following languages:// [[pcb_footprint_naming_conventions.ru|Русский]]. | ||
+ | |||
+ | ===== Footprint naming conventions ===== | ||
+ | This section describes the conventions for naming of footprints used in PCB (and gEDA/gaf).\\ | ||
+ | The purpose of the naming convention is to establish a standard to maintain the same naming convention through the different phases of the CAD chain. This helps in ensuring that the collaborative effort of gEDA/gaf is not lost. | ||
+ | |||
+ | ==== Notes ==== | ||
+ | * Unless otherwise noted, numerical pin names will be used, starting from 1. | ||
+ | * n is for the pin count. | ||
+ | * m is for the pin spacing in mils. | ||
+ | * x is for the x dimension of the package (excluding pins). In particular this is used for the QFP package family. | ||
+ | * SMT means surface mount, other components are through-hole. | ||
+ | |||
+ | ==== Integrated circuit packages ==== | ||
+ | * Dual in line packages with up to 22 100 mil spaced pins and 300 mil row spacing are called DIPn. | ||
+ | * Dual in line packages with 24 or more 100 mil spaced pins and 300 mil row spacing are called DIPnN. | ||
+ | * Dual in line packages with 100 mil spaced pins and 400 mil row spacing are called DIPnH. | ||
+ | * Dual in line packages with 24 or more 100 mil spaced pins and 600 mil row spacing are called DIPn. | ||
+ | * Shrink dual in line packages with up to 24 70 mil spaced pins and 300 mil row spacing are called SDIPn. | ||
+ | * Shrink dual in line packages with more than 24 70 mil spaced pins and 400 mil row spacing are called SDIPn. | ||
+ | * Single in line packages with 100 mil spaced pins are called SIPnN. See also JUMPER, below. | ||
+ | * Zig-zag in-line package are called ZIPn. | ||
+ | * Plastic leadless chip carrier with pin socket are called PLCCnX. | ||
+ | |||
+ | ==== Integrated circuit SMT packages ==== | ||
+ | * Small outline SMT packages with up to 16 50 mil spaced pins and 150 mil total width are called SOn. | ||
+ | * Small outline SMT packages with more than 16 50 mil spaced pins and 150 mil total width are called SOnN. | ||
+ | * Small outline SMT packages with 50 mil spaced pins and 200 mil total width are called SOnM. | ||
+ | * Small outline SMT packages with up to 20 50 mil spaced pins and 300 mil total width are called SOnW. | ||
+ | * Small outline SMT packages with more than 20 50 mil spaced pins and 300 mil total width are called SOn. | ||
+ | * Small outline SMT packages with 44 or more 50 mil spaced pins and 525 mil total width are called SOn. | ||
+ | * Metric shrink small outline SMT packages with 0.65 mm spaced pins and 323 mil total width are called MSSOPn. NOTE: To be confirmed. | ||
+ | * Metric shrink small outline SMT packages with up to 44 0.65 mm spaced pins and 420 mil total width are called MSSOPnW. | ||
+ | * Metric shrink small outline SMT packages with over 44 0.65 mm spaced pins and 545 mil total width are called MSSOPnW. | ||
+ | * Shrink small outline SMT packages with 25 mil spaced pins and 420 mil total width are called SSOPnW. | ||
+ | * Quarter size small outline SMT packages with 25 mil spaced pins and 244 mil total width are called SSOPn. | ||
+ | * Thin small outline SMT packages with 21.65 mil spaced pins and 535 mil total width are called TSOPn. | ||
+ | * Thin small outline SMT packages with 20 mil spaced pins and 795 mil total width are called TSOPnA. | ||
+ | * Thin small outline SMT packages with 20 mil spaced pins and 559 mil total width are called TSOPnB. | ||
+ | * Thin shrink small outline SMT packages with up to 28 26 mil spaced pins and 260 mil total width are called TSSOPn. | ||
+ | * Thin shrink small outline SMT packages with over 28 20 mil spaced pins and 319 mil total width are called TSSOPn. | ||
+ | * Ultra Super Mini SMT packages with up to 16 0.5 mm spaced pins are called USn. | ||
+ | * Plastic leadless chip carrier SMT are called PLCCn. | ||
+ | * Square quad-side at pack SMT are called QFPn x. | ||
+ | * Rectangular quad-side at pack SMT are called QFPn R. | ||
+ | * Square low profile quad-side at pack SMT are called LQFPn x. | ||
+ | * Square thin quad-side at pack SMT are called TQFPn x. | ||
+ | * Square Quad-side at no-lead SMT without exposed paddle (back side contact) are called QFNn x. Pin count is n and package size is x mm. | ||
+ | * Square Quad-side at no-lead SMT with exposed paddle (back side contact) are called QFNn x EP. Pin count is n and package size is x mm. | ||
+ | * Thin profile square Quad-side at no-lead SMT without exposed paddle (back side contact) are called TQFNn x. Pin count is n and package size is x mm. | ||
+ | * Thin profile square Quad-side at no-lead SMT with exposed paddle (back side contact) are called TQFNn x EP. Pin count is n and package size is x mm. | ||
+ | * Dual in line style crystal oscillators are OSC8 and OSC14. | ||
+ | * 5 pin SOT SMT packages are SOT25 and SOT325. | ||
+ | * 6 pin SOT SMT packages are SOT26 and SOT326. | ||
+ | |||
+ | ==== Basic semiconductors ==== | ||
+ | * Axial diodes are called ALFm. Pin 1 is the cathode. | ||
+ | * Conventional through hole LED is LED3 and LED5 for 3 and 5 mm respectively. Pin 1 is plus. NOTE: Should probably be changed to be in line with diode convention. | ||
+ | * TO transistors are TO5, TO92, TO126, TO220 etc. Suxes may apply, e.g. TO126W is for wide, TO126S is for standing, TO126SW is for standing, wide. | ||
+ | |||
+ | ==== Basic SMT semiconductors ==== | ||
+ | * SOD diode SMT packages use their standard package name, e.g. SOD80, SOD87, SOD106A, SOD110. There are also SOD123, SOD323 with narrow pads. | ||
+ | * SOT transistor SMT packages use their standard package name, e.g. SOT23, SOT323. There is also an SC90. | ||
+ | * SOT transistor SMT packages with numbering as for diodes (pin 1 is cathode, pin 2 anode) are SOT23D, SOT323D. | ||
+ | * 4 pin SOT SMT packages are SOT89, SOT143, SOT223. | ||
+ | |||
+ | ==== Passive components ==== | ||
+ | * Axial non-polar components (typically resistor, capacitor) are called ACYm. | ||
+ | * Bottom lead (radial) non-polar circular component (typically capacitor) is RCYm. | ||
+ | * Bottom lead non-polar rectangular component (typically capacitor) is BREm. | ||
+ | * A standard crystal is HC49, or other HC designations as required. | ||
+ | * Single row 100 mil pin spacing jumpers are JUMPERn. The main difference compared to single in line package is the hole size. | ||
+ | * Dual row 100 mil spacing headers with DIP pin numbering are HEADERn 1. Note that n is an even number. | ||
+ | * Dual row 100 mil spacing headers with ribbon cable numbering are HEADERn 2. Note that n is an even number. | ||
+ | * Angled full header connectors with latches are DIN41651 n. | ||
+ | * Standing full header connectors with latches are DIN41651 nS. | ||
+ | * DSUB connectors female are DBnF. | ||
+ | * DSUB connectors male are DBnM. | ||
+ | * Female DIN card-to-card connectors are DIN41612CnF. Add S suffix for standing. | ||
+ | * Male DIN card-to-card connectors are DIN41612CnM. Add S suffix for standing. | ||
+ | * AMP modular RJ connectors with screen are RJ11, RJ12 and RJ45. | ||
+ | |||
+ | ==== Passive SMT components ==== | ||
+ | * Standard SMT resistors, inductors, capacitors etc are 0201, 0402, 0603, 0805, 1206, 1210, 1806, 1812, 1825, 2020, 2706. | ||
+ | * Tantalum SMT capacitors are EIA3216, EIA3528, EIA6032, and EIA7343. Pin 1 is plus. | ||
+ | * SMT electrolytics are designated by can diameter in 1/10 mm: SME33, SME43, SME53, SME66, SME84, SME104. | ||