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===== Footprint naming conventions =====
This section describes the conventions for naming of footprints used in PCB (and gEDA/gaf).\\
The purpose of the naming convention is to establish a standard to maintain the same naming convention through the different phases of the CAD chain. This helps in ensuring that the collaborative effort of gEDA/gaf is not lost.

==== Notes ====
  * Unless otherwise noted, numerical pin names will be used, starting from 1.
  * n is for the pin count.
  * m is for the pin spacing in mils.
  * x is for the x dimension of the package (excluding pins). In particular this is used for the QFP package family.
  * SMT means surface mount, other components are through-hole.

==== Integrated circuit packages ====
  * Dual in line packages with up to 22 100 mil spaced pins and 300 mil row spacing are called DIPn.
  * Dual in line packages with 24 or more 100 mil spaced pins and 300 mil row spacing are called DIPnN.
  * Dual in line packages with 100 mil spaced pins and 400 mil row spacing are called DIPnH.
  * Dual in line packages with 24 or more 100 mil spaced pins and 600 mil row spacing are called DIPn.
  * Shrink dual in line packages with up to 24 70 mil spaced pins and 300 mil row spacing are called SDIPn.
  * Shrink dual in line packages with more than 24 70 mil spaced pins and 400 mil row spacing are called SDIPn.
  * Single in line packages with 100 mil spaced pins are called SIPnN. See also JUMPER, below.
  * Zig-zag in-line package are called ZIPn.
  * Plastic leadless chip carrier with pin socket are called PLCCnX.

==== Integrated circuit SMT packages ====
  * Small outline SMT packages with up to 16 50 mil spaced pins and 150 mil total width are called SOn.
  * Small outline SMT packages with more than 16 50 mil spaced pins and 150 mil total width are called SOnN.
  * Small outline SMT packages with 50 mil spaced pins and 200 mil total width are called SOnM.
  * Small outline SMT packages with up to 20 50 mil spaced pins and 300 mil total width are called SOnW.
  * Small outline SMT packages with more than 20 50 mil spaced pins and 300 mil total width are called SOn.
  * Small outline SMT packages with 44 or more 50 mil spaced pins and 525 mil total width are called SOn.
  * Metric shrink small outline SMT packages with 0.65 mm spaced pins and 323 mil total width are called MSSOPn. NOTE: To be confirmed.
  * Metric shrink small outline SMT packages with up to 44 0.65 mm spaced pins and 420 mil total width are called MSSOPnW.
  * Metric shrink small outline SMT packages with over 44 0.65 mm spaced pins and 545 mil total width are called MSSOPnW.
  * Shrink small outline SMT packages with 25 mil spaced pins and 420 mil total width are called SSOPnW.
  * Quarter size small outline SMT packages with 25 mil spaced pins and 244 mil total width are called SSOPn.
  * Thin small outline SMT packages with 21.65 mil spaced pins and 535 mil total width are called TSOPn.
  * Thin small outline SMT packages with 20 mil spaced pins and 795 mil total width are called TSOPnA.
  * Thin small outline SMT packages with 20 mil spaced pins and 559 mil total width are called TSOPnB.
  * Thin shrink small outline SMT packages with up to 28 26 mil spaced pins and 260 mil total width are called TSSOPn.
  * Thin shrink small outline SMT packages with over 28 20 mil spaced pins and 319 mil total width are called TSSOPn.
  * Ultra Super Mini SMT packages with up to 16 0.5 mm spaced pins are called USn.
  * Plastic leadless chip carrier SMT are called PLCCn.
  * Square quad-side at pack SMT are called QFPn x.
  * Rectangular quad-side at pack SMT are called QFPn R.
  * Square low profile quad-side at pack SMT are called LQFPn x.
  * Square thin quad-side at pack SMT are called TQFPn x.
  * Square Quad-side at no-lead SMT without exposed paddle (back side contact) are called QFNn x. Pin count is n and package size is x mm.
  * Square Quad-side at no-lead SMT with exposed paddle (back side contact) are called QFNn x EP. Pin count is n and package size is x mm.
  * Thin profile square Quad-side at no-lead SMT without exposed paddle (back side contact) are called TQFNn x. Pin count is n and package size is x mm.
  * Thin profile square Quad-side at no-lead SMT with exposed paddle (back side contact) are called TQFNn x EP. Pin count is n and package size is x mm.
  * Dual in line style crystal oscillators are OSC8 and OSC14.
  * 5 pin SOT SMT packages are SOT25 and SOT325.
  * 6 pin SOT SMT packages are SOT26 and SOT326.

==== Basic semiconductors ====
  * Axial diodes are called ALFm. Pin 1 is the cathode.
  * Conventional through hole LED is LED3 and LED5 for 3 and 5 mm respectively. Pin 1 is plus. NOTE: Should probably be changed to be in line with diode convention.
  * TO transistors are TO5, TO92, TO126, TO220 etc. Suxes may apply, e.g. TO126W is for wide, TO126S is for standing, TO126SW is for standing, wide.

==== Basic SMT semiconductors ====
  * SOD diode SMT packages use their standard package name, e.g. SOD80, SOD87, SOD106A, SOD110. There are also SOD123, SOD323 with narrow pads.
  * SOT transistor SMT packages use their standard package name, e.g. SOT23, SOT323. There is also an SC90.
  * SOT transistor SMT packages with numbering as for diodes (pin 1 is cathode, pin 2 anode) are SOT23D, SOT323D.
  * 4 pin SOT SMT packages are SOT89, SOT143, SOT223.

==== Passive components ====
  * Axial non-polar components (typically resistor, capacitor) are called ACYm.
  * Bottom lead (radial) non-polar circular component (typically capacitor) is RCYm.
  * Bottom lead non-polar rectangular component (typically capacitor) is BREm.
  * A standard crystal is HC49, or other HC designations as required.
  * Single row 100 mil pin spacing jumpers are JUMPERn. The main difference compared to single in line package is the hole size.
  * Dual row 100 mil spacing headers with DIP pin numbering are HEADERn 1. Note that n is an even number.
  * Dual row 100 mil spacing headers with ribbon cable numbering are HEADERn 2. Note that n is an even number.
  * Angled full header connectors with latches are DIN41651 n.
  * Standing full header connectors with latches are DIN41651 nS.
  * DSUB connectors female are DBnF.
  * DSUB connectors male are DBnM.
  * Female DIN card-to-card connectors are DIN41612CnF. Add S suffix for standing.
  * Male DIN card-to-card connectors are DIN41612CnM. Add S suffix for standing.
  * AMP modular RJ connectors with screen are RJ11, RJ12 and RJ45.

==== Passive SMT components ====
  * Standard SMT resistors, inductors, capacitors etc are 0201, 0402, 0603, 0805, 1206, 1210, 1806, 1812, 1825, 2020, 2706.
  * Tantalum SMT capacitors are EIA3216, EIA3528, EIA6032, and EIA7343. Pin 1 is plus.
  * SMT electrolytics are designated by can diameter in 1/10 mm: SME33, SME43, SME53, SME66, SME84, SME104.
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